FPGA Monero Mining Source-Codes

---

FPGA:

---

Video Source in Title link Blow:

AltCoin Mining, Source-code DeCompile ReCompile.

---

Reference Material Link To Site embedded in Title.

Xilinx Virtex-7 2000T FPGA provides over 20 million ASIC gates per-chip Date: 09m-24d-2018y, the present purchase cost of a Xilinx XC7V2000T Chip is $1k.

---

Xilinx has announced the first shipments of its Virtex-7 2000T Field Programmable Gate Array (FPGA). The Virtex-7 2000T is the world’s highest-capacity programmable logic device – it contains 6.8 billion transistors, providing customers access to 2 million logic cells.

This is equivalent to 20 million ASIC gates, which makes these devices ideal for system integration, ASIC replacement, and ASIC prototyping and emulation.

This capacity is made possible by Xilinx’s Stacked Silicon Interconnect technology – also referred to as 2.5D ICs. The simplest packaging technology is to have a single die in the package.

The next step up the “complexity ladder” is to have multiple die is the same package, but for all of these die to be attached directly to the package substrate. In this case, compared to the tracks on the die, the tracks on the package substrate are relatively large, slow, and driving signals onto them consumes a lot of power.

In this first incarnation of the technology, four FPGA die are attached to the silicon interposer, which – in addition to connecting the FPGAs to each other – provides connections to the package as illustrated below.

In the case of the Virtex-7 2000T, the FPGA die are implemented at the 28 nm technology node, while the passive silicon interposer is implemented at the 65 nm technology node. Implementing the large silicon interposer at this higher node reduces costs and increases yield without significantly degrading performance.

One way to think about this is that the silicon interposer essentially adds four additional tracking layers that can be used to connect the FPGAs to each other with more than 10,000 connections between each pair of adjacent die!

On top of this, Through-Silicon Vias (TSVs) are used to pass signals through the silicon interposer to C4 bumps on the bottom of the interposer. These bumps are then used to connect the interposer to the package substrate.

A view of Xilinx’s Virtex-7 2000T device showing the
packaging substrate (bottom), silicon interposer (middle),
and four FPGA die (top).

Compared with having to use standard I/O connections to integrate two FPGAs together on a circuit board, this stacked silicon interconnect technology is said to provide over 100X the die-to-die connectivity bandwidth-per-watt, at one-fifth the latency, without consuming any of the FPGAs' high-speed serial or parallel I/O resources.

Of particular interest to designers is the fact that, despite being composed of four die, the Virtex-7 2000T preserves the traditional FPGA use model in that users will program the device as one extremely large FPGA with the Xilinx tool flow and methodology.

Xilinx’s first application of 2.5D IC stacking gives customers twice the capacity of competing devices and leaps ahead of what Moore’s Law could otherwise offer in a monolithic 28-nanometer (nm) FPGA.

Xilinx says that its customers can use Virtex-7 2000T FPGAs to replace large capacity ASICs to achieve overall comparable total costs in a third of the time, creating integrated systems that increase system bandwidth and reduce power by eliminating I/O interconnect, and accelerating the prototyping and emulation of advanced ASIC systems.

A top and bottom view of Xilinx’s Virtex-7 2000T
device, the world’s highest-capacity FPGA using
Stacked Silicon Interconnect technology.

 “The Virtex-7 2000T FPGA marks a major milestone in Xilinx’s history of innovation and industry collaboration,” said Victor Peng, Xilinx Senior Vice President, Programmable Platforms Development.  

“Of significance to our customers is the fact that Stacked Silicon Interconnect technology offers capacities that otherwise wouldn’t be possible in an FPGA for at least another process generation. 

They can immediately add new functionality to existing designs while forgoing an ASIC, cost reduce a 3 or 5 FPGA solution into a single FPGA or move ahead with prototyping and building system emulators using our largest FPGAs at least a year earlier than typical for a new generation.”


The Virtex-7 2000T device also provides equipment manufacturers with an integration platform that will help them overcome the challenges of lowering power while increasing performance and capabilities.

By eliminating the I/O interfaces between different ICs on a circuit board, a system’s overall power consumption can be reduced considerably.

Consider the following example provided by Xilinx that compares a single Virtex-7 2000T with four of the largest monolithic ICs as illustrated below:

Actually, this is not really a fair comparison, because in terms of capacity the Virtex-7 2000T is equivalent to only around two of the largest monolithic ICs. But even comparing to two monolithic ICs results in a significant power advantage. (Having said this, I’d be interested to know just what was being exercised in this example – Logic? Memory? DSP slices? SERDES channels? – and at what frequency.)

---

Reference Material Link To Siste embedded in Title.

FPGA programming step by step...

FPGAs and microprocessors are more similar than you may think. Here's a primer on how to program an FPGA and some reasons why you'd want to. Small processors are, by far, the largest selling class of computers and form the basis of many embedded systems. The first single-chip microprocessors contained approximately 10,000 gates of logic and 10,000 bits of memory. Today, field programmable gate arrays (FPGAs) provide single chips approaching 10 million gates of logic and 10 million bits of memory. Figure 1 compares one of these microprocessors with an FPGA.

Figure 1: Comparison of first microprocessors to current FPGAs
Powerful tools exist to program these powerful chips. Unlike microprocessors, not only the memory bits, but also the logical gates are under your control as the programmer. This article will show the programming process used for FPGA design.
As an embedded systems programmer, you're aware of the development processes used with microprocessors. The development process for FPGAs is similar enough that you'll have no problem understanding it but sufficiently different that you'll have to think differently to use it well. We'll use the similarities to understand the basics, then discuss the differences and how to think about them.
Similarities
Table 1 shows the steps involved in designing embedded systems with a microprocessor and an FPGA. This side-by-side comparison lets you quickly assess the two processes and see how similar they are.
Table 1: Step-by-step design process for microprocessors and FPGAs

---